| 摘要 |
Pads are arranged as an integrated circuit (IC) footprint, and are formed in a stackup that includes an insulating layer and multiple signal routing layers. The footprint has a polygonal shape. There is an inner pad region, a middle pad region that surrounds the inner pad region, and an outer pad region that surrounds the middle pad region. Some of the pads of each pad region are connected to a respective group of signal lines. Some of the signals that are connected to pads of the outer region which are located in a corner of the polygonal shape are routed out of the footprint in a different layer than the one used to route signal lines that are connected to pads of the outer region which are located between two adjacent corners of the polygonal shape.
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