发明名称 |
METHODS OF FORMING METALLURGY STRUCTURES FOR WIRE AND SOLDER BONDING AND RELATED STRUCTURES |
摘要 |
Metallurgy structures (34a'-d') for input/output pads (23a-d) of an electronic device can be adapted to receive both solder and wire bonds. First and second metallurgy structures, for example, can be provided on respective first and second input/output pads of an electronic device such that the first and second common metallurgy structures have a shared structure adapted to receive both solder and wire bonds. A solder bond can thus be applied to the first metallurgy structure, (346', 34c') and a wire bond can be applied to the second metallurgy structure (34a', 34d'). |
申请公布号 |
WO03028088(A3) |
申请公布日期 |
2003.11.20 |
申请号 |
WO2002US30697 |
申请日期 |
2002.09.26 |
申请人 |
UNITIVE ELECTRONICS, INC. |
发明人 |
MIS, J., DANIEL;ENGEL, KEVIN |
分类号 |
H01L23/50;H01L25/065;H05K3/24;H05K3/32;H05K3/34 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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