REAR SURFACE IRRADIATION PHOTODIODE ARRAY AND METHOD FOR PRODUCING THE SAME

摘要

Both electrodes of the anode and cathode of a photodiode in a semiconductor substrate (1) are collected at one side thereof. This is achieved by leading one electrode electrically to the other side through a hole H penetrating the semiconductor substrate (1) and the time required for boring the hole H is shortened because the semiconductor substrate (1) has been made thin by polishing. Since a supporting substrate (3) is attached to the semiconductor substrate (1) in order to reinforce the thinned substrate during production process, handling of the wafer is facilitated during process resulting in a photodiode suitable for mass production.