| 摘要 |
<p>A process for producing a high temperature heat resisting carrier foil clad electrolytic copper foil from which detachment of a carrier foil is easy even after press working at 200ºC or higher. In particular, for example, a process for producing a high temperature heat resisting carrier foil clad electrolytic copper foil, comprising forming an organic joint interface layer on a surface of carrier foil with the use of an organic agent and further forming an electrolytic copper foil on the organic joint interface layer, characterized in that in the formation of organic joint interface on the surface of carrier foil, a pickling solution containing 50 to 2000 ppm of an organic agent for formation of joint interface layer is applied so as to, while effecting acid cleaning and dissolution of the surface of carrier foil, cause the organic agent to be adsorbed thereon, thereby forming a pickling adsorption organic coating.</p> |
