| 摘要 |
A packaging tape includes a carrier tape and a top tape. The carrier tape is provided with device-accommodating recesses. The top tape is attached to the carrier tape by heat-sealing to close the device-accommodating recesses. The carrier tape includes a resin layer made by impregnation and drying of a water-dispersible resin or a water-soluble resin or both. The top tape is attached to the resin layer of the carrier tape. This prevents the generation of static electricity on the top tape as the top tape is peeled off the carrier tape. Accordingly, the unscheduled removal of electronic devices from the device-accommodating recesses by the static electricity is avoided.
|
