Method for improving airflow in subrack mechanics by using a hybrid serial/parallel fan configuration

摘要

Disclosed is an improved fan module for use in an electronic enclosure. The fans are arranged in a hybrid serial parallel configuration which provides both redundant flow of successive fans and the ability to flow around a failed or locked fan to continue airflow. The fans are further arranged in an angled configuration to provide airflow through the enclosure without the need for baffles or other thermodynamic steering devices.