Semiconductor device used in silicon microelectronics comprises a first substrate with an integrated component, a second substrate with an integrated repeater, a coupling layer arranged between the substrates, and a contacting element

摘要

Semiconductor device comprises a first substrate (101) with an integrated component (102), a second substrate (103) with an integrated repeater (104), a coupling layer (105) arranged between the substrates, and a contacting element (106) for electrically coupling the component to the repeater. An Independent claim is also included for a process for the production of the semiconductor device.