| 摘要 |
The bump underlying metal film has a first metallic deposit film formed by a first electroless plating method, and a second metallic deposit film formed on the first metallic deposit film by a second electroless plating method using a plating solution different in type from that used in the first electroless plating method. The bump underling metal film is so arranged that the first metallic deposit film has a thickness larger than the organic insulating film, and the first metallic deposit film has a peripheral portion superposed on the organic insulating film.
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