| 摘要 |
<p>Methods and apparatus for selectively processing objects with a plasma formed in a cavity (12) with electromagnetic radiation. In one embodiment, a method can be provided that includes placing the object in the cavity (12) such that a first gap (525) is formed, having a thickness less than about λ/4, between a first surface region (510) of the object and the inner surface of the cavity, and a second gap (526) is formed, having a thickness at least about λ /4, between a second surface region (520) and the inner surface, introducing gas into the cavity; and irradiating the cavity with the radiation to form a plasma in the second gap but not in the first gap.</p> |
