| 摘要 |
<p>Disclosed is an improved heat conduction system capable of minimizing a temperature variation between formed laminates at a cooling process. Some laminates interposed between the upper and lower platens are formed under a heated and pressurized environment. The present invention employs a separator with a heat conducting layer therein and a side heat-conducting unit closely contacted to a side of the separator for additionally conducting heat to platens, so that it solves the problems contained in a conventional cooling process, as well as maintaining the advantages of the conventional cooling process.</p> |
