| 摘要 |
PURPOSE: A semiconductor optical device package and a manufacturing method thereof are provided to reduce the size of a product by using a flip chip bonding and a silicon hole to manufacture an optical device package. CONSTITUTION: A solder bump(14) is formed on an electrode pad of an optical device(11), which is provided with a waveguide or a light-receiving region(12) and one more than electrode pad on a surface thereof. A silicon substrate(15) includes a metal wiring layer(16) deposited and patterned with a metal thin film, a protective film(17) on the metal wiring layer(16), a flip chip bonding band patterned with the protective film(17) selectively, a substrate metal pad, and a silicon hole(20). A solder ball(21) is an electrical intermediate and adhered to the substrate metal pad on the silicon substrate(15). After the optical device(11) and an optical fiber(22) are formed in line through the silicon hole(20) formed on the silicon substrate(15), the optical fiber(22) is fixed on a silicon substrate(15) by adhesives(23).
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