| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless copper plating method by which the stability of a copper replenishment liquid in a copper decomposition tank and a copper storage tank is increased to prevent the production of cuprous oxide, and the copper replenishment liquid having a prescribed copper concentration can be fed to a plating tank, to provide an apparatus therefor, to provide a copper replenishment apparatus therefor, and to provide a method of stabilizing the copper replenishment liquid. SOLUTION: A part of an electroless copper plating liquid in a plating tank is extracted. An oxygen-containing gas is blown into the plating liquid. Copper plating is performed while replenishing the plating tank with the electroless copper plating liquid with at least one kind selected from cupric hydroxide and cupric oxide dissolved by the electroless copper plating liquid. The electroless copper plating apparatus is provided with a copper decomposition tank in which a copper replenishment liquid is produced by dissolving at least one kind selected from cupric hydroxide and cupric oxide with the electroless copper plating liquid transferred with a transfer pump from the plating tank, an oxygen-containing gas jetting means for blowing an oxygen-containing gas into the copper decomposition tank, and a path for feeding the copper replenishment liquid in the copper decomposition tank into the plating tank. COPYRIGHT: (C)2004,JPO
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