发明名称 METHOD FOR MANUFACTURING METALLIC PATTERN, METHOD FOR MANUFACTURING CONTACT PROBE AND CONTACT PROBE
摘要 PROBLEM TO BE SOLVED: To improve shape accuracy of metallic patterns. SOLUTION: A supporting substrate 46 provided with a base metal layer 47 made of Cu on its surface is used as a ground surface for forming pattern wiring of a contact probe. A black layer 47a to absorb exposure light is formed on the surface of the base metal layer 47 by subjecting the surface to a blackening treatment. A photoresist layer 48 is formed on the supporting substrate 46 and is exposed by applying a photomask 49 (mask pattern) thereon to form non-fixed parts 51 of the same patterns as the pattern wiring and fixed parts 52 exclusive of the non-fixed parts 52 on the photoresist layer 48. The photomask 49 and the non-fixed parts 51 are removed, and the black layer 47a within apertures 48a of the photoresist layer 48 obtained in such a manner is removed. A Ni-base alloy layer (metallic layer) is formed as the pattern wiring by plating within the apertures 48a and after the fixed parts 52 are removed, a film is bonded onto the pattern wiring and these are separated from the supporting substrate 46. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003328183(A) 申请公布日期 2003.11.19
申请号 JP20020141620 申请日期 2002.05.16
申请人 MITSUBISHI MATERIALS CORP 发明人 MASUDA AKIHIRO;KATO NAOKI;KAWAKAMI YOSHIAKI;SUGIYAMA TATSUO
分类号 G01R1/073;C25D1/00;C25D5/02;C25D7/00;H01L21/66;(IPC1-7):C25D5/02 主分类号 G01R1/073
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