发明名称 |
METHOD FOR MANUFACTURING METALLIC PATTERN, METHOD FOR MANUFACTURING CONTACT PROBE AND CONTACT PROBE |
摘要 |
PROBLEM TO BE SOLVED: To improve shape accuracy of metallic patterns. SOLUTION: A supporting substrate 46 provided with a base metal layer 47 made of Cu on its surface is used as a ground surface for forming pattern wiring of a contact probe. A black layer 47a to absorb exposure light is formed on the surface of the base metal layer 47 by subjecting the surface to a blackening treatment. A photoresist layer 48 is formed on the supporting substrate 46 and is exposed by applying a photomask 49 (mask pattern) thereon to form non-fixed parts 51 of the same patterns as the pattern wiring and fixed parts 52 exclusive of the non-fixed parts 52 on the photoresist layer 48. The photomask 49 and the non-fixed parts 51 are removed, and the black layer 47a within apertures 48a of the photoresist layer 48 obtained in such a manner is removed. A Ni-base alloy layer (metallic layer) is formed as the pattern wiring by plating within the apertures 48a and after the fixed parts 52 are removed, a film is bonded onto the pattern wiring and these are separated from the supporting substrate 46. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2003328183(A) |
申请公布日期 |
2003.11.19 |
申请号 |
JP20020141620 |
申请日期 |
2002.05.16 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
MASUDA AKIHIRO;KATO NAOKI;KAWAKAMI YOSHIAKI;SUGIYAMA TATSUO |
分类号 |
G01R1/073;C25D1/00;C25D5/02;C25D7/00;H01L21/66;(IPC1-7):C25D5/02 |
主分类号 |
G01R1/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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