SEALING EPOXY RESIN MOLDING MATERIAL AND ELECTRONIC COMPONENT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a sealing epoxy resin material which contains a metal oxide or a metal hydroxide and shows excellent moldability and an electronic component device equipped with an element sealed with this material. SOLUTION: The sealing epoxy resin molding material essentially comprises (A) an epoxy resin, (B) a hardener and (C) an aluminum oxide or the metal hydroxide treated with a releasing agent. The electronic component device is equipped with the element sealed with this material. COPYRIGHT: (C)2004,JPO