| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable protection structure of a wiring board preventing corrosion of the wiring caused by moisture, reactive gases, and foreign matters in the ambient atmosphere. SOLUTION: A 1st sealing part A is formed in an area which is between a 2nd substrate 24 and a 3rd substrate 25 and in which an electrode layer 21 arranged on a 1st substrate 22 is exposed. The 1st sealing part A is constituted of an element side 1st protective layer 37 and an element side 2nd protective layer 39. The element side 1st protective layer 37 covers an electrode layer 32 and is arranged over one end part 25a of the 3rd substrate 25 faced to the 2nd substrate 24 and one end part 24a of the 2nd substrate 24 faced to the 3rd substrate 25. The element side 2nd protective layer 39 covers the element side 1st protective layer 37 over one end of the 3rd substrate 25 faced to the 2nd substrate 24 and one end part 24a of the 2nd substrate 24 faced to the 3rd substrate 25 so that the element side 1st protective layer 37 is not exposed outside. COPYRIGHT: (C)2004,JPO
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