| 发明名称 |
BLIND VIA HOLE FILLING METHOD |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of filling metallic copper having excellent electric conductivity into a blind via hole without leaving gaps therein. SOLUTION: A copper sulfate plating bath is used which contains (a) polyether containing at least 5 ether oxygen atoms in one molecule and (b) a compound expressed by the chemical formula of R<SB>1</SB>-S-(CH<SB>2</SB>O)<SB>n</SB>-R<SB>2</SB>-SO<SB>3</SB>M (wherein, R<SB>1</SB>is a hydrogen atom, -(S)<SB>n</SB>-(CH<SB>2</SB>O)<SB>n</SB>-R<SB>2</SB>-SO<SB>3</SB>M or -CS<SB>n</SB>-(CH<SB>2</SB>O)<SB>n</SB>-R<SB>2</SB>-SO<SB>3</SB>M; R<SB>2</SB>is an alkylene group containing 3 to 8 carbon atoms; M denotes a hydrogen atom or an alkali metal; and n is 0 or 1). Then, either electrode consisting of a plating substrate of the object to be plated and the other electrode dipped into the copper sulfate plating bath are subjected to electric copper plating while reversing an electric current at the cycle of a positive electrolysis time of 1 to 50 msec, a reverse electrolysis time of 0.2 to 5 msec and a quiescent time of 1 to 50 msec. COPYRIGHT: (C)2004,JPO
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| 申请公布号 |
JP2003328185(A) |
申请公布日期 |
2003.11.19 |
| 申请号 |
JP20020142549 |
申请日期 |
2002.05.17 |
| 申请人 |
DENSO CORP;LEARONAL JAPAN INC;SHIMADA PHYS & CHEM IND CO LTD |
发明人 |
TOMISAKA MANABU;OTA YASUO;SUDA KAZUYUKI;ANDO HIDEKAZU;SHIMADA KIYOSHI;NOBATA HIROYOSHI;OISHI TETSUSHI;ABE YUSUKE;SONODA HARUKI;TACHIHABA YOSHITO |
| 分类号 |
C25D3/38;C25D5/18;C25D7/12;H01L21/28;H01L21/288;H01L21/3205;H01L21/768;H01L23/52;H05K3/42;(IPC1-7):C25D7/12;H01L21/320 |
主分类号 |
C25D3/38 |
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