| 摘要 |
PROBLEM TO BE SOLVED: To solve the conventional problem that a used target has to be replaced if particles start to emerge. SOLUTION: The magnetron sputtering device 1 is capable of switching the range of magnetic fluxes 16a, 16b between the one smaller than the target 13 and the one larger than the target 13 and its backing plate 14. The range of the magnetic fluxes 16a, 16b is switched by a doughnut-shaped magnetic shielding material 19 under a magnet 15. For the film forming on the surface of a wafer 11, the range of the magnetic flux 16a is made smaller than the target 13. Cleaning is performed by removing the magnetic shielding material 19 and making the range of the magnetic flux 16b larger than the target 13 and the backing plate 14. COPYRIGHT: (C)2004,JPO
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