METHOD FOR FORMING FINE CIRCUIT WIRING AND APPARATUS USED FOR THE SAME

摘要

PROBLEM TO BE SOLVED: To provide means for preventing migration by slowing down and suppressing the movement of the copper atoms themselves from fine copper wiring formed by copper plating. SOLUTION: The method for forming fine circuit wiring comprises forming a first plating layer by plating including the metal diffusible into the copper (provided that alloy plating with the copper is precluded) and a second plating layer by copper plating on a substrate for electronic circuits which is provided with fine circuit patterns and is formed with a barrier layer and a seed layer at need. COPYRIGHT: (C)2004,JPO