发明名称 |
PLATED MATERIAL, PRODUCTION METHOD THEREOF AND ELECTRICAL AND ELECTRONIC PARTS OBTAINED BY USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a plated material which combines satisfactory heat resistance and inserting/extracting properties. SOLUTION: An undercoat layer 2 consisting of any one kind selected from Fe or an Fe alloy, Ni or an Ni alloy, and Co or a Co alloy, the first intermediate plating layer 3 consisting of Sn or an Sn alloy, the second intermediate plating layer 4 consisting of Cu or a Cu alloy and a surface plating layer 5 consisting of Sn or an Sn alloy are formed on the surface of an electrically conductive substrate 1 in this order. COPYRIGHT: (C)2004,JPO
|
申请公布号 |
JP2003328157(A) |
申请公布日期 |
2003.11.19 |
申请号 |
JP20020130690 |
申请日期 |
2002.05.02 |
申请人 |
FURUKAWA ELECTRIC CO LTD:THE |
发明人 |
TANAKA HITOSHI;MATSUDA AKIRA;SUZUKI SATOSHI;TANIMOTO MORIMASA |
分类号 |
C25D7/00;C23C30/00;H01R13/03;(IPC1-7):C23C30/00 |
主分类号 |
C25D7/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|