发明名称 PLATED MATERIAL, PRODUCTION METHOD THEREOF AND ELECTRICAL AND ELECTRONIC PARTS OBTAINED BY USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a plated material which combines satisfactory heat resistance and inserting/extracting properties. SOLUTION: An undercoat layer 2 consisting of any one kind selected from Fe or an Fe alloy, Ni or an Ni alloy, and Co or a Co alloy, the first intermediate plating layer 3 consisting of Sn or an Sn alloy, the second intermediate plating layer 4 consisting of Cu or a Cu alloy and a surface plating layer 5 consisting of Sn or an Sn alloy are formed on the surface of an electrically conductive substrate 1 in this order. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003328157(A) 申请公布日期 2003.11.19
申请号 JP20020130690 申请日期 2002.05.02
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 TANAKA HITOSHI;MATSUDA AKIRA;SUZUKI SATOSHI;TANIMOTO MORIMASA
分类号 C25D7/00;C23C30/00;H01R13/03;(IPC1-7):C23C30/00 主分类号 C25D7/00
代理机构 代理人
主权项
地址