| 摘要 |
PROBLEM TO BE SOLVED: To obtain a radiation-curing type resin composition which is used for adhesives, has excellent adhesiveness to silver, gold, aluminum, polycarbonate disks, and the like, excellent resistance to moisture and heat, and excellent stability under fluorescent lamps, has quick curability, especially quick curability on the end surfaces of optical disks, and is thereby highly useful for producing the optical disks in comparison with conventional adhesives. SOLUTION: This radiation-curing type resin composition for adhesives is characterized by comprising (A) a hydroxyl group-containing bisphenol type epoxy (meth)acrylate, (B) a polyfunctional (meth)acrylate having structural units of general formula (1) [R is H or methyl; (n) is an integer of 1 to 3] in the repeating number of 2 to 10 except the component (A), and (C) a photopolymerization initiator, wherein the contents of the components (A) and (B) in the composition are≥30 wt. % and≥20 wt.%, respectively. COPYRIGHT: (C)2004,JPO
|
