发明名称 CONTINUOUS SURFACE TREATMENT METHOD FOR COPPER FOIL AND APPARATUS THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a continuous surface treatment method for copper foil and an apparatus therefor realizing uniform treatment without narrowly setting the width of an anode plate nor causing the lowering of the treating capacity in both sides (vicinities of the edges) in the width direction of copper foil and excessive electrodeposition to the edge parts, and realizing improvement in the productivity. SOLUTION: Copper foil is continuously passed to the fronts of anode plates set in an electrolytic cell and opposite to each other, and surface treatment is performed. In this case, a pair of straightening plates are arranged in the space between both edge parts of the copper alloy to be passed and both edge parts of the anode plates, and then, the surface treatment is performed. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003328194(A) 申请公布日期 2003.11.19
申请号 JP20020139439 申请日期 2002.05.15
申请人 NIKKO MATERIALS CO LTD 发明人 ARAI EITA
分类号 C25D7/06;C25D17/10;C25D17/12;(IPC1-7):C25D17/10 主分类号 C25D7/06
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