STIRRING APPARATUS FOR PLATING SOLUTION

摘要

PROBLEM TO BE SOLVED: To provide a stirring apparatus for a plating solution capable of applying a uniform plating treatment even to substrate products having blind via holes in particular by enhancing stirring efficiency of the plating solution and making the current density of the plating solution uniform. SOLUTION: Bladed stirring members 6 having perpendicular stirring elements 7 are interposed between the substrate products W put into the plating solution and anodes. The stirring elements 7 of the members 6 are linearly oscillated back and forth to a direction opposite from the forward and backward linear oscillation of the substrate products so as to traverse the entire transverse width of the substrate surfaces of the substrate products along the neighborhood of the substrate surfaces with respect to the substrate products W under the forward and backward linear oscillation. COPYRIGHT: (C)2004,JPO