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发明名称
Method and apparatus for plating a substrate
摘要
申请公布号
EP0901153(A3)
申请公布日期
2003.11.19
申请号
EP19980116569
申请日期
1998.09.02
申请人
EBARA CORPORATION
发明人
KURIYAMA, FUMIO;HONGO, AKIHISA;INOUE, HIROAKI;TOKUOKA, TSUYOSHI
分类号
H01L21/00;(IPC1-7):H01L21/00;C23C18/18
主分类号
H01L21/00
代理机构
代理人
主权项
地址
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