发明名称 METHOD FOR BONDING PLATE MATERIAL
摘要 PROBLEM TO BE SOLVED: To excellently arrange respective one side faces of a plurality of plate materials on the same plane after their bonding in a plate material bonding method for mutually bonding the plate materials so that the respective one side faces of the plate materials are arranged on the same plane. SOLUTION: When a cover 3 is bonded to the transparent plates 5 so that the surfaces (underside faces) are arranged on the same plane, after the arrangement, a pressure sensitive adhesive tape 9 is attached from the surface sides to boundaries between the cover 3 and the transparent plates (A). Then, an adhesive 7 is poured from an inside to the boundaries between the cover 3 and the transparent plates 5 (B). After the bonding is completed, the pressure sensitive adhesive tape 9 is released. The surfaces are excellently arranged on the same plane and the overflow of the adhesive 7 is favorably prevented by attaching the pressure sensitive adhesive tape 9 to the boundaries. Since the coated surface of the pressure sensitive adhesive is in contact with the adhesive 7, the pressure sensitive adhesive tape 9 is readily released by peeling the pressure sensitive adhesive from the substrate of the pressure sensitive adhesive tape 9. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003327923(A) 申请公布日期 2003.11.19
申请号 JP20020135675 申请日期 2002.05.10
申请人 KITAGAWA IND CO LTD 发明人 ICHII TAKAHISA
分类号 C09J5/00;(IPC1-7):C09J5/00 主分类号 C09J5/00
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