| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that, when the correlation between the result of a defect inspection and the result of an electric test are taken, much labor and time are required for a re-observation in order to improve the reliability of the correlation analysis. SOLUTION: This apparatus 1 for inspecting defect is provided with an external appearance inspecting part 2 for inspecting the external appearance of a semiconductor wafer 4, a signal converting part 11 for converting an image signal obtained by photographing the semiconductor wafer 4 in the external appearance inspecting part 2 into a luminance signal, a defect detecting part 12 for detecting defects by using the luminance signal converted in the signal converting part 11, and a defect sorting part 13 for sorting the defects detected in the defect detecting part 12 according to the relative density of a circuit pattern in the surroundings of the defects. COPYRIGHT: (C)2004,JPO
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