发明名称 AQUEOUS CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an aqueous curable resin composition having excellent stability and low-temperature curability of the composition, forming a cured product having excellent heat resistance and having excellent low irritation without causing medicine wounds, etc., by the composition. SOLUTION: The aqueous curable composition comprises a compound (A) containing≥2 specific alkenyloxy groups in one molecule, a resin (B) having≥1 hydroxy groups and≥1 carboxy groups in one molecule, respectively at 0.55-1.25 equivalents/kg carboxy group concentration and a phosphoric acid compound (C). At least a part of the carboxy groups in the resin (B) and phosphate groups in the phosphoric acid compound (C) are neutralized and the compound (A), the resin (B) and the phosphoric acid compound (C) are dispersed in an aqueous medium. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003327855(A) 申请公布日期 2003.11.19
申请号 JP20020141301 申请日期 2002.05.16
申请人 KANSAI PAINT CO LTD 发明人 OBATA SEIJI;YONEHARA YOICHI;ISOZAKI OSAMU
分类号 B05D7/24;C08K3/32;C08K5/00;C08K5/521;C08L101/08;C09D5/00;C09D201/08;(IPC1-7):C08L101/08 主分类号 B05D7/24
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