| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin having high heat resistance, humidity resistance, and toughness and favorable for using in a multilayered printed wiring board, as an alternative material for optical glass, as a coating material, or the like. SOLUTION: The bifunctional epoxy resin is represented by formula (1) [wherein X consists of units represented by formula (a) and formula (b) (wherein R<SB>1</SB>, R<SB>2</SB>, R<SB>5</SB>, and R<SB>6</SB>are each independently hydrogen, a 1-6C hydrocarbon group or a halogen, Y represents a direct bond, O, S, SO, SO<SB>2</SB>, CO, C(R<SB>0</SB>)<SB>2</SB>, C(R<SB>0</SB>)<SB>2</SB>-ϕ-C(R<SB>0</SB>)<SB>2</SB>, or a 9,9-fluorenyl group,ϕrepresents phenylene group, and R<SB>0</SB>, R<SB>3</SB>, and R<SB>4</SB>represent each independently hydrogen or methyl group) and percentage of the unit (a) in the total X is not less than 10-100 mol%, and (n) is a number not less than 2], and the epoxy resin composition is compounded with the epoxy resin. COPYRIGHT: (C)2004,JPO
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