METHOD FOR INSTALLING SEMICONDUCTOR DEVICE MANUFACTURING EQUIPMENT

摘要

PURPOSE: A method for installing semiconductor device manufacturing equipment is provided to be capable of reducing installing time and increasing the operating ratio of the semiconductor device manufacturing equipment for improving productivity. CONSTITUTION: A plurality of process lines(G) are arrayed and prolonged to the predetermined portion of semiconductor device manufacturing equipment. At this time, the process lines include a power line and fluid lines. A plurality of connection lines(G') are installed at the predetermined portion of the semiconductor device manufacturing equipment. Then, each connection line is connected with the process lines corresponding to each process line. Preferably, a connection block(20) is installed at the predetermined portion for limiting the array range of the process lines.