发明名称 TESTING APPARATUS FOR HIGH-FREQUENCY CHARACTERISTIC OF CHIP-TYPE ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a testing apparatus for a high-frequency characteristic which enhances a transmission characteristic of a high-frequency signal and which precisely measures a high-frequency characteristic of a chip-type electronic component, by a method wherein an impedance is matched near the chip-type electronic component as an object to be measured and a rise in an ambient temperature including a probe, and the chip-type electronic component is suppressed effectively. SOLUTION: The probe 3 is brought into contact with the chip-type electronic component 1 placed on a stage 2, the high-frequency signal is input to the electronic component 1 via the probe 3 from a high-frequency transmission line, and the high-frequency characteristic of the electronic component 1 is tested. An impedance matching element 14 with which the probe 3 comes into contact together with the electronic component 1 is arranged in a position adjacent to the electronic component 1 on the stage 2. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003329725(A) 申请公布日期 2003.11.19
申请号 JP20020132442 申请日期 2002.05.08
申请人 MITSUBISHI ELECTRIC CORP 发明人 MURAYAMA HIDEYUKI;NAKAMURA SATOSHI
分类号 G01R31/26;G01R1/06;G01R31/28;(IPC1-7):G01R31/26 主分类号 G01R31/26
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