| 摘要 |
PROBLEM TO BE SOLVED: To provide a curing composition rapidly cured and capable of giving such a low elastic cured resin as to absorb deformation caused by stress, and to provide a rapid-curing adhesive by using the curing composition. SOLUTION: This curing composition contains (A) an organic compound which has a carbon-carbon double bond having reactivity with a SiH group, (B) a silicon compound which has at least two SiH groups in its molecule, (C) a hydrosilylation catalyst, and (D) an adhesion-improving agent as essential ingredients, wherein the cured product therefrom has a storage elastic modulus in tension of≤2,000 MPa at 0°C. COPYRIGHT: (C)2004,JPO
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