摘要 |
PROBLEM TO BE SOLVED: To provide a conductive, polyimide resin-based endless tubular film having a very low surface resistivity; and a surface-metallized, polyimide resin- based endless tubular film which is free from the deterioration of adhesive power between the film surface and the metal layer caused by heat hysteresis or the like. SOLUTION: The polyimide resin-based endless tubular film has a surface resistivity of 1Ω/square or lower. By using the film as a cathode, a metal layer can be directly formed on the film surface by electroplating to obtain a surface-metallized polyimide resin-based endless tubular film exhibiting strong adhesive power between the film surface and the metal layer. COPYRIGHT: (C)2004,JPO
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