| 摘要 |
PROBLEM TO BE SOLVED: To provide a curing resin composition from which a printed circuit board having good heat resistance, exhibiting such moldability and processability as similar to those of conventional heat-curing resin laminated sheets, and having a low dissipation factor in a high-frequency wave range so as to be excellently low in dielectric loss is obtained, to provide prepreg given by using the composition, and to provide a laminated sheet plated with metal. SOLUTION: This modified isocyanate ester-based curing resin composition contains (A) isocyanate ester compounds, (B) monohydric phenol compounds, (C) a polybutadiene resin, (D) a flame-retardant which has no reactivity with the isocyanate ester compounds, and (E) a metal-based reaction catalyst as essential ingredients. The prepreg for the laminated sheet is formed by making the composition dissolved or dispersed in a solvent to obtain a resin varnish for the laminated sheet, immersing a base material in the varnish, and drying the immersed base material. The laminated sheet plated with the metal is formed by laminating pieces of the prepreg in an arbitrary number together with metal foil, then heating and pressurizing the laminated materials. COPYRIGHT: (C)2004,JPO |
