SEALING EPOXY RESIN MOLDING MATERIAL AND ELECTRONIC COMPONENT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a sealing epoxy resin material which contains a metal oxide or a metal hydroxide and shows excellent moldability and an electronic component device equipped with an element sealed with this material. SOLUTION: The sealing epoxy resin molding material essentially comprises (A) an epoxy resin, (B) a hardener and (C) the metal oxide or the metal hydroxide treated with a releasing agent, provided that component (C) is treated with the releasing agent using an organic solvent containing at least one polar organic solvent and at least one nonpolar organic solvent. The electronic component device is equipped with the element sealed with this material. COPYRIGHT: (C)2004,JPO