发明名称 RESIN COMPOSITION FOR DIRECT PLATING
摘要 PROBLEM TO BE SOLVED: To provide a resin composition for direct plating, having excellent direct plating property, especially the extensibility of an electric copper plating layer and having excellent impact resistance and heat-resistance. SOLUTION: The resin composition for direct plating is composed of (C) 10-50 mass% graft copolymer produced by grafting (b) a monomer containing an aromatic vinyl compound and a vinyl cyanide compound to (a) a rubbery polymer having an average particle diameter of 0.2-0.5μm and containing 5-20 mass% particles having particle diameter of 0.8-1.5μm, (E) 5-40 mass% copolymer composed of (e1) an aromatic vinyl compound, (e2) a vinyl cyanide compound and (e3) other monovinyl compound and (D) 20-70 mass% polycarbonate resin. The invention further provides a resin plating method to apply a Pd-Sn colloid catalyst treatment to a molded article of the resin composition, make the article electrically conductive and apply direct electric plating, and a plated resin article produced by the plating method. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003327817(A) 申请公布日期 2003.11.19
申请号 JP20020131931 申请日期 2002.05.07
申请人 MITSUBISHI RAYON CO LTD 发明人 SAKAI HIROSHI;FUJII SEIZO
分类号 C08L69/00;C08L25/12;C08L51/04;C08L55/02;C25D5/56;(IPC1-7):C08L69/00 主分类号 C08L69/00
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