发明名称 |
Process and apparatus for flow soldering |
摘要 |
A flow soldering process for mounting an electronic component onto a board by means of a lead-free solder material. Molten solder material is supplied and attached to a predetermined portion of the board in a solder material supplying zone, and the board is thereafter cooled by a cooling unit in a cooling zone such that the solder material adhering to the board is rapidly cooled to solidify.
|
申请公布号 |
US6648216(B2) |
申请公布日期 |
2003.11.18 |
申请号 |
US20010924555 |
申请日期 |
2001.08.09 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
YAMAGUCHI ATSUSHI;HIRANO MASATO;SAKAI YOSHINORI |
分类号 |
B23K1/00;B23K1/08;H05K3/34;(IPC1-7):B23K31/02 |
主分类号 |
B23K1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|