发明名称 Integrated circuit having a micromagnetic device and method of manufacture therefor
摘要 An integrated circuit and method of manufacturing therefor. In one embodiment, the integrated circuit includes a substrate with an insulator and a capacitor formed over the substrate. The integrated circuit further includes an adhesive formed over the insulator. The integrated circuit still further includes a micromagnetic device. The micromagnetic device includes a ferromagnetic core formed over the adhesive. The adhesive forms a bond between the insulator and the ferromagnetic core to secure the ferromagnetic core to the substrate. The micromagnetic device also includes at least one winding, located proximate the ferromagnetic core, to impart a desired magnetic property to the ferromagnetic core. The micromagnetic device is electrically coupled to the capacitor.
申请公布号 US6649422(B2) 申请公布日期 2003.11.18
申请号 US20010886780 申请日期 2001.06.21
申请人 AGERE SYSTEMS INC. 发明人 KOSSIVES DEAN P.;LOTFI ASHRAF W.;SCHNEEMEYER LYNN F.;STEIGERWALD MICHAEL L.;VAN DOVER R. BRUCE
分类号 H01F3/02;H01F17/00;H01F27/00;H01F41/04;H01L21/822;H01L21/8234;H01L27/04;H01L27/06;H03H7/01;H03H7/075;(IPC1-7):H01L21/00 主分类号 H01F3/02
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