Integrated circuit device defect detection method and apparatus employing light emission imaging

摘要

A method of and apparatus (10) for detecting one or more defects (130) in a plurality of chips (110) on a wafer (40). The method comprises a first step of simultaneously providing electrical power to the plurality of chips, thereby generating one or more light signals (120) corresponding to the one or more defects in the plurality of chips. The second step is simultaneously forming an image (150) of the plurality of chips so as to simultaneously detect the one or more light signals. The apparatus (10) for carrying out the method comprises electrical probes (30) for providing electrical power to the plurality of chips, a detector (60) to detect the one or more light signals emitted by the chips as a result of electrical power interacting with the one or more defects, and an imaging system (50) arranged so as to form an image of the plurality of chips, including the light signals, onto the detection surface (64).