发明名称 Method for the formation and lift-off of porous silicon layers
摘要 A method for the manufacture, formation, and removal of porous layers in a semiconductor substrate having at least a surface acting as a cathode. The method comprises applying a solution comprising negative Fluorine (F<->) ions between the surface of the semiconductor substrate and an anode. The method further comprises applying a predetermined current between the anode and the cathode. The method further comprises maintaining the predetermined current at substantially the same current value for a sufficient amount of time to obtain a low porosity layer at said surface. A high porosity layer positioned under the low porosity layer is also obtained by the method of the invention.
申请公布号 US6649485(B2) 申请公布日期 2003.11.18
申请号 US20010802756 申请日期 2001.03.09
申请人 INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC) 发明人 SOLANKI CHETAN SINGH;BILYALOV RENAT;POORTMANS JEF;BEAUCARNE GUY
分类号 H01L21/306;H01L21/3063;H01L21/762;(IPC1-7):H01L21/76 主分类号 H01L21/306
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