发明名称 |
Mirrortron sputtering apparatus |
摘要 |
A mirrortron sputtering apparatus for sputtering on a substrate includes a vacuum chamber for placing therein a pair of targets spaced apart from each other with inner surfaces thereof facing each other and outer surfaces thereof positioned opposite to the inner surfaces, and magnets respectively disposed closer to the outer surfaces of the targets for forming a magnetic field between said pair of targets. The magnetic field has a magnetic field distribution with a peripheral region having a high magnetic flux density and a center region having a low magnetic flux density. In this arrangement, the substrate is set alongside a space between the pair of targets as facing said magnetic field.
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申请公布号 |
US6649036(B2) |
申请公布日期 |
2003.11.18 |
申请号 |
US20010781102 |
申请日期 |
2001.02.08 |
申请人 |
HIRATA TOYOAKI |
发明人 |
HIRATA TOYOAKI;NAOE MASAHIKO |
分类号 |
C23C14/00;C23C14/35;H01J37/34;(IPC1-7):C23C14/35 |
主分类号 |
C23C14/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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