发明名称 Thin film polycrystalline memory structure
摘要 A polycrystalline memory structure is described for improving reliability and yield of devices employing polycrystalline memory materials comprising a polycrystalline memory layer, which has crystal grain boundaries forming gaps between adjacent crystallites overlying a substrate. An insulating material is located at least partially within the gaps to at least partially block the entrance to the gaps. A method of forming a polycrystalline memory structure is also described. A layer of material is deposited and annealed to form a polycrystalline memory material having gaps between adjacent crystallites. An insulating material is deposited over the polycrystalline memory material to at least partially fill the gaps, thereby blocking a portion of each gap.
申请公布号 US6649957(B2) 申请公布日期 2003.11.18
申请号 US20030345725 申请日期 2003.01.15
申请人 SHARP LABORATORIES OF AMERICA, INC. 发明人 HSU SHENG TENG;LI TINGKAI;ZHANG FENGYAN;ZHUANG WEI-WEI
分类号 H01L27/10;H01L21/02;H01L21/28;H01L21/8246;H01L21/8247;H01L27/105;H01L29/788;H01L29/792;H01L43/08;H01L45/00;(IPC1-7):H01L29/76 主分类号 H01L27/10
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