发明名称 Low profile DC distribution module for a power supply unit
摘要 A DC distribution module for a power supply unit is modular and facilitates thermal cooling of the unit. The power supply unit preferably includes a housing in which one or more power supply modules and the DC distribution module can be inserted. The DC distribution module preferably comprises two power conductors laminated and bonded to a ground conductor. The DC distribution module is relatively thin compared to the power supplies inserted into the power supply unit. By being relatively thin, the DC distribution module, which may carry substantial amounts of current, does not substantially interfere with air movement through the power supply unit for thermal cooling purposes.
申请公布号 US6650537(B2) 申请公布日期 2003.11.18
申请号 US20010999575 申请日期 2001.10.31
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 PEREIRA ROBERT A.;VARGHESE PAILY T.
分类号 G06F1/18;G06F1/26;H02J1/06;(IPC1-7):H05K5/00 主分类号 G06F1/18
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