发明名称 |
Heat conductive silicone composition and semiconductor device |
摘要 |
A heat conductive silicone composition comprising (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having Si-H groups on side chains, (C) an organohydrogenpolysiloxane having an Si-H group at either end, (D) a filler consisting of aluminum powder and zinc oxide powder in a weight ratio of from 1/1 to 10/1, (E) a platinum catalyst, and (F) a regulator has a high thermal conductivity and maintains flexibility even when exposed to heat for an extended period of time.
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申请公布号 |
US6649258(B2) |
申请公布日期 |
2003.11.18 |
申请号 |
US20020133312 |
申请日期 |
2002.04.29 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
YAMADA KUNIHIRO;ISOBE KENICHI |
分类号 |
C08L83/07;C08K3/08;C08K3/22;C08K5/5415;C08K5/5419;C08L83/04;C08L83/05;H01L23/36;H01L23/373;(IPC1-7):B32B25/20;H01L23/34;H01B1/20 |
主分类号 |
C08L83/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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