发明名称 |
Lead-free solder alloy powder paste use in PCB production |
摘要 |
Tombstoning susceptibility and reflow peak temperature reduction of solder alloys, in particularly lead-free solder alloys, has been found to be achieved effectively by mixing the solder alloy in the form of an alloy paste with a low melting alloy utilised in powder form, in particular a Bi-containing alloy.
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申请公布号 |
US6648210(B1) |
申请公布日期 |
2003.11.18 |
申请号 |
US20010673529 |
申请日期 |
2001.02.09 |
申请人 |
MULTICORE SOLDERS LIMITED |
发明人 |
STEEN HECTOR ANDREW HAMILTON |
分类号 |
B23K1/00;B23K35/02;B23K35/14;B23K35/26;B23K101/42;C22C12/00;C22C13/00;C22C13/02;H05K3/34;(IPC1-7):B23K31/02;B23K35/34;C22C7/00 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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