发明名称 Polishing system
摘要 The present invention aims at make automatic real-time measurement of the removal rate in during polishing. For achieving the aim, a polishing system is provided with a sensor 1 for measuring a friction generated between a polishing pad and a workpiece during the polishing. The information processor of the polishing system evaluates the polishing efficiency of the polishing pad 5 on the basis of a fluctuation in the removal rate which is successively obtained from a friction successively detected by the sensor and a predetermined function. The result of the evaluation is used for the determination of the execution timing of a dressing process for the polishing pad, the calculation of the removal from the workpiece, and the like.
申请公布号 US6648728(B2) 申请公布日期 2003.11.18
申请号 US20010949605 申请日期 2001.09.12
申请人 HITACHI, LTD. 发明人 KOJIMA HIROYUKI;OHKAWA TETSUO;SATO HIDEMI
分类号 B24B37/00;B24B37/04;B24B49/10;B24B49/16;B24B49/18;B24B53/00;B24B53/007;B24B53/017;B24B53/02;H01L21/304;(IPC1-7):B24B49/00 主分类号 B24B37/00
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