| 摘要 |
A semiconductor device using a lead frame as a wiring base member, in which lead electrodes connected to a semiconductor chip through a connecting lead are arranged radially around the semiconductor chip having an upper surface and an under surface. The semiconductor chip, connecting leads, and lead electrodes are integrally sealed in a resin. Each of the lead electrodes includes a thin internal lead portion having a connection part on an upper surface side, and a thick external electrode portion protruding toward an under surface side to form a connection part. The resin has an underside which is substantially co-planar with the under surface of the internal lead portion of the lead electrodes, and the external electrode portion protrudes from the underside of the resin.
|
