| 摘要 |
The resin-sealed semiconductor device includes a die pad portion, a semiconductor element mounted on the die pad portion and having electrodes, a plurality of lead portions arranged with their respective tips facing the die pad portion, thin metal wires for connecting the electrodes of the semiconductor element to the lead portions, and a sealing resin for sealing the die pad portion, the semiconductor element, the lead portions and connection regions of the thin metal wires except a bottom surface of the die pad portion and respective bottom surfaces and terminal ends of the lead portions. The terminal ends of the lead portions are approximately flush with a side surface of the sealing resin. The die pad portion has a first recess formed in an outer periphery of the bottom surface thereof.
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