发明名称 IMPROVEMENTS RELATING TO HEATSINKS
摘要 The present invention relates to components and a method for automated assembly of a heatsink (13), component (11) and PCB (12) assembly. The heatsink (13), component (11) and/or PCB (12) are profiled to compensate for part manufacturing tolerances, so that a separation exits between a surface of the heatsink (13) and bottom surface of the component (11) upon assembly. Coupling medium is the separation is heated conform to the separation and form a bridging thermal joint between the heatsink (13) and component (11).
申请公布号 AU2003228162(A1) 申请公布日期 2003.11.17
申请号 AU20030228162 申请日期 2003.05.02
申请人 TAIT ELECTRONICS LIMITED 发明人 MARK, WILLIAM COTTON;DANIEL, RICHARD FOSTER;BRENT, LAIRD DRYSDALE;DAVID SIMMONS
分类号 H01L23/367;H05K1/02;H05K1/18;H05K3/34;(IPC1-7):H05K7/20;H05K3/00 主分类号 H01L23/367
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