发明名称 |
IMPROVEMENTS RELATING TO HEATSINKS |
摘要 |
The present invention relates to components and a method for automated assembly of a heatsink (13), component (11) and PCB (12) assembly. The heatsink (13), component (11) and/or PCB (12) are profiled to compensate for part manufacturing tolerances, so that a separation exits between a surface of the heatsink (13) and bottom surface of the component (11) upon assembly. Coupling medium is the separation is heated conform to the separation and form a bridging thermal joint between the heatsink (13) and component (11). |
申请公布号 |
AU2003228162(A1) |
申请公布日期 |
2003.11.17 |
申请号 |
AU20030228162 |
申请日期 |
2003.05.02 |
申请人 |
TAIT ELECTRONICS LIMITED |
发明人 |
MARK, WILLIAM COTTON;DANIEL, RICHARD FOSTER;BRENT, LAIRD DRYSDALE;DAVID SIMMONS |
分类号 |
H01L23/367;H05K1/02;H05K1/18;H05K3/34;(IPC1-7):H05K7/20;H05K3/00 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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