发明名称
摘要 PURPOSE:To polish the surface to be polished of a base at an uniform rate by building a temperature control means for generating a prescribed temperature distribution along the radial direction of the base placing surface in a base holding base. CONSTITUTION:A base 25 is held by a base holding base 26, and the temperature of its base placing surface is regulated by heaters 28a, 28b, for example, to have a low temperature in the central part and a high temperature in the outer circumferential part. This is rotated around a holding base rotating shaft 27, and an abrasive 22 is supplied onto an abrasive cloth 29 from an abrasive supply pipe 21 in the state where a rotating fixed plate 23 is also rotated around a fixed plate rotating shaft 24. The surface to be polished of the base 25 is slid onto the abrasive cloth 29 to polish the surface to be polished of the base 25. The temperature distribution of the base placing base is regulated so that the high molecular particle present on the sliding surface between the abrasive cloth 29 and the base 25 is differed in hardness between the central part and outer circumferential part of the sliding surface. Thus, the surface to be polished of the base 25 can be polished at an uniform polishing rate.
申请公布号 JP3467822(B2) 申请公布日期 2003.11.17
申请号 JP19940017207 申请日期 1994.02.14
申请人 发明人
分类号 B24B1/00;B24B37/00;B24B37/015;B24B37/04;H01L21/304 主分类号 B24B1/00
代理机构 代理人
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