| 摘要 |
PROBLEM TO BE SOLVED: To realize a resin burr removing mechanism which is capable of preventing a lead frame from falling off from a transfer belt when resin burrs are removed by high-pressure water, wherein the resin burr removing mechanism is used for removing resin burrs with high-pressure water in a pre-plating treatment in a semiconductor device assembly process where a frame is plated with solder after a resin sealing operation is finished. SOLUTION: A back plate is switched from a stationary type to a movable type, and a mechanism which moves the movable back plate 1 synchronously with the movement of a lead frame is additionally provided. The lead frame moves synchronously with the movement of the transfer belt 19. At this point, pilot pins 18A, pilot pins 6A and pilot holes 7B are engaged with each other, whereby rotation is transmitted to the movable back plate 1 synchronously with the movement of the transfer belt 19. The movable back plate 1 is made to operate synchronously with the direction and speed of movement of the transfer belt 19 by the above transmission of rotation. A rinsing function of removing foreign objects from the surface of the back plate is added. |
