发明名称 Semiconducting rod cutting procedure - using encapsulation to give smooth surfaces
摘要 <p>Before cutting, a workpiece is encapsulated in polyurethane, PVC, epoxy resin, polystyrol or polyester of a min. wt. of 1 lb/cu.ft. The method is suitable for S-C material such as silicon and germanium, but may also be used for quartz, thin copper tube or bronze. A set of rods may be encapsulated side by side in e.g. a rectangular block and an equal cut made across them. The material may be cast or sprayed on the workpieces, and avoids handling and cleaning problems of wax.</p>
申请公布号 DE2138401(A1) 申请公布日期 1972.02.10
申请号 DE19712138401 申请日期 1971.07.31
申请人 发明人
分类号 B28D5/00 主分类号 B28D5/00
代理机构 代理人
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